GET https://dev.normadoc.fr/products/ieee-c62-38-1994-r1999-ieee00002854-241405

Response
200 OK
IP
216.73.217.103
Profiled on
Token
8dd328

Components

3 Twig Components
5 Render Count
3 ms Render Time
220.0 MiB Memory Usage

Components

Name Metadata Render Count Render Time
ProductState 
"App\Twig\Components\ProductState"
components/ProductState.html.twig 		2 0.70ms
ProductMostRecent 
"App\Twig\Components\ProductMostRecent"
components/ProductMostRecent.html.twig 		2 1.70ms
ProductType 
"App\Twig\Components\ProductType"
components/ProductType.html.twig 		1 0.22ms

Render calls

ProductState App\Twig\Components\ProductState 220.0 MiB 0.44 ms
Input props 
[
  "product" => App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  "showFullLabel" => "true"
]
Attributes 
[
  "showFullLabel" => "true"
]
Component 
App\Twig\Components\ProductState {#93009
  +product: App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  +appearance: "state-withdrawn"
  +labels: [
    "Withdrawn"
    "Confirmed"
  ]
  -stateAttributeCode: "state"
  -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …}
}
ProductType App\Twig\Components\ProductType 220.0 MiB 0.22 ms
Input props 
[
  "product" => App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
]
Attributes 
[]
Component 
App\Twig\Components\ProductType {#93202
  +product: App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  +label: "Standard"
  -typeAttributeCode: "type"
  -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …}
}
ProductMostRecent App\Twig\Components\ProductMostRecent 220.0 MiB 0.75 ms
Input props 
[
  "product" => App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
]
Attributes 
[]
Component 
App\Twig\Components\ProductMostRecent {#93277
  +product: App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  +label: "Most Recent"
  +icon: "check-xs"
  -mostRecentAttributeCode: "most_recent"
  -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …}
}
ProductState App\Twig\Components\ProductState 220.0 MiB 0.27 ms
Input props 
[
  "product" => App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  "showFullLabel" => "true"
]
Attributes 
[
  "showFullLabel" => "true"
]
Component 
App\Twig\Components\ProductState {#100206
  +product: App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  +appearance: "state-withdrawn"
  +labels: [
    "Withdrawn"
    "Confirmed"
  ]
  -stateAttributeCode: "state"
  -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …}
}
ProductMostRecent App\Twig\Components\ProductMostRecent 220.0 MiB 0.95 ms
Input props 
[
  "product" => App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
]
Attributes 
[]
Component 
App\Twig\Components\ProductMostRecent {#100290
  +product: App\Entity\Product\Product {#7309
    #id: 9753
    #code: "IEEE00002854"
    #attributes: Doctrine\ORM\PersistentCollection {#7702 …}
    #variants: Doctrine\ORM\PersistentCollection {#7745 …}
    #options: Doctrine\ORM\PersistentCollection {#7917 …}
    #associations: Doctrine\ORM\PersistentCollection {#7901 …}
    #createdAt: DateTime @1751038528 {#7274
      date: 2025-06-27 17:35:28.0 Europe/Paris (+02:00)
    }
    #updatedAt: DateTime @1754607611 {#7322
      date: 2025-08-08 01:00:11.0 Europe/Paris (+02:00)
    }
    #enabled: true
    #translations: Doctrine\ORM\PersistentCollection {#7923 …}
    #translationsCache: [
      "en_US" => App\Entity\Product\ProductTranslation {#7922
        #locale: "en_US"
        #translatable: App\Entity\Product\Product {#7309}
        #id: 34021
        #name: "IEEE C62.38:1994 (R1999)"
        #slug: "ieee-c62-38-1994-r1999-ieee00002854-241405"
        #description: """
          New IEEE Standard - Inactive-Withdrawn.<br />\n
          This guide establishes test methods for the evaluation of ESD withstand capability for electronic equipment subassemblies. It includes information about test conditions, test equipment, and test procedures for ESD tests of printed circuit boards and other subassemblies.<br />\n
          \t\t\t\t<br />\n
          The test methods described are intended to be used to discover subassembly failures that result from destructive ESD, as well as those failures that may result from modification of data stored in subassemblies [e.g., in nonvolatile memory elements such as electronically erasable programmable read-only memory (EEPROM) or battery supported random access memory (RAM)]. This guide does not specify ESD tests to characterize the withstand capability of subassemblies that are incomplete (e.g., in the process of being manufactured), nor the expected ESD immunity of externally powered and/or installed subassemblies. Also, this guide does not specify tests for completed equipment or systems, whether powered or not, nor does it specify ESD tests for individual electronic components, such as integrated circuits. Such ESD tests are covered in other standards (see IEC Pub 801-2 (1991), , , and ).<br />\n
          The purpose of this guide is to define test methods to evaluate the electrostatic discharge (ESD) withstand capability of finished subassemblies that have not been incorporated into the next higher-level assembly. Test methods are defined to evaluate the ability of such subassemblies to withstand ESD that occurs due to handling, shipping, and installation. These environments may not necessarily be ESD-controlled environments. Some typical electronic subassemblies are populated printed circuit boards, circuit packs, power supplies, plug-in modules, and disk drives.
          """
        #metaKeywords: null
        #metaDescription: null
        #shortDescription: "IEEE Guide on Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods (for Electronic Equipment Subassemblies)"
        -notes: "Inactive-Withdrawn"
      }
    ]
    #currentLocale: "en_US"
    #currentTranslation: null
    #fallbackLocale: "en_US"
    #variantSelectionMethod: "match"
    #productTaxons: Doctrine\ORM\PersistentCollection {#7535 …}
    #channels: Doctrine\ORM\PersistentCollection {#7629 …}
    #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7308 …}
    #reviews: Doctrine\ORM\PersistentCollection {#7614 …}
    #averageRating: 0.0
    #images: Doctrine\ORM\PersistentCollection {#7646 …}
    -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7422 …}
    -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7420 …}
    -apiLastModifiedAt: DateTime @1754517600 {#7317
      date: 2025-08-07 00:00:00.0 Europe/Paris (+02:00)
    }
    -lastUpdatedAt: DateTime @1578006000 {#7292
      date: 2020-01-03 00:00:00.0 Europe/Paris (+01:00)
    }
    -author: ""
    -publishedAt: DateTime @798674400 {#7318
      date: 1995-04-24 00:00:00.0 Europe/Paris (+02:00)
    }
    -releasedAt: null
    -confirmedAt: DateTime @930348000 {#7316
      date: 1999-06-26 00:00:00.0 Europe/Paris (+02:00)
    }
    -canceledAt: DateTime @1106607600 {#7315
      date: 2005-01-25 00:00:00.0 Europe/Paris (+01:00)
    }
    -edition: null
    -coreDocument: "C62.38"
    -bookCollection: ""
    -pageCount: 19
    -documents: Doctrine\ORM\PersistentCollection {#7466 …}
    -favorites: Doctrine\ORM\PersistentCollection {#7501 …}
  }
  +label: "Most Recent"
  +icon: "check-xs"
  -mostRecentAttributeCode: "most_recent"
  -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …}
}