Components
4
Twig Components
8
Render Count
15
ms
Render Time
96.0
MiB
Memory Usage
Components
| Name | Metadata | Render Count | Render Time |
|---|---|---|---|
| ProductState |
"App\Twig\Components\ProductState"components/ProductState.html.twig |
3 | 0.91ms |
| ProductMostRecent |
"App\Twig\Components\ProductMostRecent"components/ProductMostRecent.html.twig |
3 | 3.85ms |
| ProductType |
"App\Twig\Components\ProductType"components/ProductType.html.twig |
1 | 0.31ms |
| ProductCard |
"App\Twig\Components\ProductCard"components/ProductCard.html.twig |
1 | 10.95ms |
Render calls
| ProductState | App\Twig\Components\ProductState | 66.0 MiB | 0.47 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } "showFullLabel" => "true" ] |
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| Attributes | [ "showFullLabel" => "true" ] |
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| Component | App\Twig\Components\ProductState {#93008 +product: App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } +appearance: "state-withdrawn" +labels: [ "Withdrawn" ] -stateAttributeCode: "state" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
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| ProductType | App\Twig\Components\ProductType | 68.0 MiB | 0.31 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } ] |
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| Attributes | [] |
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| Component | App\Twig\Components\ProductType {#93188 +product: App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } +label: "Standard" -typeAttributeCode: "type" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
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| ProductMostRecent | App\Twig\Components\ProductMostRecent | 68.0 MiB | 2.30 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } ] |
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| Attributes | [] |
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| Component | App\Twig\Components\ProductMostRecent {#93263 +product: App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } +label: "Most Recent" +icon: "check-xs" -mostRecentAttributeCode: "most_recent" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
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| ProductState | App\Twig\Components\ProductState | 74.0 MiB | 0.22 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } "showFullLabel" => "true" ] |
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| Attributes | [ "showFullLabel" => "true" ] |
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| Component | App\Twig\Components\ProductState {#100216 +product: App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } +appearance: "state-withdrawn" +labels: [ "Withdrawn" ] -stateAttributeCode: "state" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
|||
| ProductMostRecent | App\Twig\Components\ProductMostRecent | 74.0 MiB | 0.78 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } ] |
|||
| Attributes | [] |
|||
| Component | App\Twig\Components\ProductMostRecent {#100300 +product: App\Entity\Product\Product {#7311 #id: 9312 #code: "IEEE00002039" #attributes: Doctrine\ORM\PersistentCollection {#7701 …} #variants: Doctrine\ORM\PersistentCollection {#7744 …} #options: Doctrine\ORM\PersistentCollection {#7916 …} #associations: Doctrine\ORM\PersistentCollection {#7900 …} #createdAt: DateTime @1751038159 {#7274 : 2025-06-27 17:29:19.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#7322 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#7922 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#7921 #locale: "en_US" #translatable: App\Entity\Product\Product {#7311} #id: 32257 #name: "IEEE 1355:1995" #slug: "ieee-1355-1995-ieee00002039-240964" #description: """ New IEEE Standard - Inactive-Withdrawn.<br />\n Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.<br />\n \t\t\t\t<br />\n Physical connectors and cables, electrical properties, and logical protocols for point to point serial scaleable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies (as developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).<br />\n To enable high-performance, scaleable, modular, parallel systems to be constructed with low system integration cost; to support communications system fabric; to provide a transparent implementation of a range of high level protocols (communications, e.g. Asynchronous Transfer Mode (ATM), message passing, shared memory transactions e.g. SCI, Futurebus+, etc.; to support links between heterogeneous systems. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)" -notes: "Inactive-Withdrawn" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#7534 …} #channels: Doctrine\ORM\PersistentCollection {#7628 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#7613 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#7645 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#7321 …} -apiLastModifiedAt: DateTime @1754517600 {#7317 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578006000 {#7292 : 2020-01-03 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @834530400 {#7318 : 1996-06-12 00:00:00.0 Europe/Paris (+02:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1106607600 {#7316 : 2005-01-25 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1355" -bookCollection: "" -pageCount: 148 -documents: Doctrine\ORM\PersistentCollection {#7465 …} -favorites: Doctrine\ORM\PersistentCollection {#7500 …} } +label: "Most Recent" +icon: "check-xs" -mostRecentAttributeCode: "most_recent" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
|||
| ProductCard | App\Twig\Components\ProductCard | 96.0 MiB | 10.95 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } "layout" => "vertical" "showPrice" => true "showStatusBadges" => true "additionalClasses" => "product__teaser--with-grey-border" "hasStretchedLink" => true "hoverType" => "shadow" "linkLabel" => "See more" ] |
|||
| Attributes | [] |
|||
| Component | App\Twig\Components\ProductCard {#121612 +product: App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } +layout: "vertical" +showPrice: true +showStatusBadges: true +additionalClasses: "product__teaser--with-grey-border" +linkLabel: "See more" +imageFilter: "product_thumbnail_teaser" +hasStretchedLink: true +backgroundColor: "white" +hoverType: "shadow" } |
|||
| ProductState | App\Twig\Components\ProductState | 96.0 MiB | 0.22 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } ] |
|||
| Attributes | [ "showFullLabel" => false ] |
|||
| Component | App\Twig\Components\ProductState {#121656 +product: App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } +appearance: "state-withdrawn" +labels: [ "Withdrawn" ] -stateAttributeCode: "state" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
|||
| ProductMostRecent | App\Twig\Components\ProductMostRecent | 96.0 MiB | 0.77 ms | |
|---|---|---|---|---|
| Input props | [ "product" => App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } ] |
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| Attributes | [] |
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| Component | App\Twig\Components\ProductMostRecent {#121732 +product: App\Entity\Product\Product {#121556 #id: 9278 #code: "IEEE00001981" #attributes: Doctrine\ORM\PersistentCollection {#121539 …} #variants: Doctrine\ORM\PersistentCollection {#121537 …} #options: Doctrine\ORM\PersistentCollection {#121532 …} #associations: Doctrine\ORM\PersistentCollection {#121534 …} #createdAt: DateTime @1751038130 {#121529 : 2025-06-27 17:28:50.0 Europe/Paris (+02:00) } #updatedAt: DateTime @1754607004 {#121564 : 2025-08-08 00:50:04.0 Europe/Paris (+02:00) } #enabled: true #translations: Doctrine\ORM\PersistentCollection {#121550 …} #translationsCache: [ "en_US" => App\Entity\Product\ProductTranslation {#121654 #locale: "en_US" #translatable: App\Entity\Product\Product {#121556} #id: 32121 #name: "IEEE 1301.3:1992" #slug: "ieee-1301-3-1992-ieee00001981-240930" #description: """ New IEEE Standard - Inactive-Reserved.<br />\n Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.<br />\n \t\t\t\t<br />\n This is a detail standard for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-19911 and a 2.5 mm connector in accordance with IEC 48B (Central Office) 245.<br />\n This standard is an implementation of IEEE Std 1301-1991. This standard may be used with other IEEE Std 1301.x connector implementations in the same subrack. """ #metaKeywords: null #metaDescription: null #shortDescription: "IEEE Standard for a Metric Equipment Practice for Microcomputers - Convection-Cooled with 2.5 mm Connectors" -notes: "Inactive-Reserved" } ] #currentLocale: "en_US" #currentTranslation: null #fallbackLocale: "en_US" #variantSelectionMethod: "match" #productTaxons: Doctrine\ORM\PersistentCollection {#121548 …} #channels: Doctrine\ORM\PersistentCollection {#121541 …} #mainTaxon: Proxies\__CG__\App\Entity\Taxonomy\Taxon {#7309 …} #reviews: Doctrine\ORM\PersistentCollection {#121545 …} #averageRating: 0.0 #images: Doctrine\ORM\PersistentCollection {#121543 …} -supplier: Proxies\__CG__\App\Entity\Supplier\Supplier {#7324 …} -subscriptionCollections: Doctrine\ORM\PersistentCollection {#121558 …} -apiLastModifiedAt: DateTime @1754517600 {#121515 : 2025-08-07 00:00:00.0 Europe/Paris (+02:00) } -lastUpdatedAt: DateTime @1578956400 {#121563 : 2020-01-14 00:00:00.0 Europe/Paris (+01:00) } -author: "" -publishedAt: DateTime @723078000 {#121522 : 1992-11-30 00:00:00.0 Europe/Paris (+01:00) } -releasedAt: null -confirmedAt: null -canceledAt: DateTime @1573081200 {#121535 : 2019-11-07 00:00:00.0 Europe/Paris (+01:00) } -edition: null -coreDocument: "1301.3" -bookCollection: "" -pageCount: 32 -documents: Doctrine\ORM\PersistentCollection {#121554 …} -favorites: Doctrine\ORM\PersistentCollection {#121552 …} } +label: "Most Recent" +icon: "check-xs" -mostRecentAttributeCode: "most_recent" -localeContext: Sylius\Component\Locale\Context\CompositeLocaleContext {#1833 …} } |
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